Gel-Pak Partners With BAE Systems On Solution For Costly Component-Out-Of-Pocket Defects Posted on April 9, 2021 (November 22, 2024) by JastMedia ☰ Quick Links × Quick Links E-Store Request Quote Request Sample Contact Technical Support Product Selection Wizard Calculate Number Of Devices/Carrier Gel-Pak Brochure Problem / Application Many of today’s leading semiconductor manufacturers experience issues with thin compound semi die (<250μm) migrating out of the pockets of waffle pack trays during shipping. BAE Systems, a large international defense electronics company, has documented the high cost of RMAs, yield loss and rework labor associated with this die migration issue. Based on Delphon’s fundamental capabilities in solving complex materials and manufacturing problems, BAE Systems selected Delphon’s Gel-Pak division as a partner to identify the root causes of this costly Component-Out-Of-Pocket (COOP) condition. The study revealed that COOP is attributed to deficiencies in the existing waffle pack tray/lid technology, which results in gaps between the tray and lid, such as: Warpage common to injection molded chip trays and lids. Misalignment and/or pinching of non-woven polyethylene inserts (such as Tyvek paper) when preparing waffle pack for shipment. Uneven stresses, caused by the industry standard one-piece clip, which deforms the chip tray and lid. Challenges/Requirements Uniformly seal each individual tray pocket. Compensate for waffle pack tray and lid flatness issues. Be compatible with existing pick & place equipment infrastructure. Only use static dissipative, low outgassing, non-silicone, FOD-free materials that are prevalent in the semiconductor industry. Develop a methodology to validate that the solution eliminates COOP. Gel-Pak Solution Leveraging Delphon’s expertise in solving complex product development and manufacturing challenges, Gel-Pak worked closely with the customers to define their unique requirements. The R&D team researched TPE chemistries to develop a Gel-Pak bio-inspired texturized film with properties that mimic the adhesive forces of biometric structures found in nature. The TPE material was optimized to minimize transference and outgassing. The texturized film “dimple” geometry and tack levels were optimized to securely hold devices while allowing for easy of unload The final film construction consisted of the textured film bonded to a base PET substrate along with a coversheet. A pressure sensitive adhesive (PSA) was laminated to backside of PET substrate in order to mount the film to a standard JEDEC format tray or a customer-specified carrier. Outcome Working closely with its customers, Gel-Pak improved the efficiency of in-process handling of the OSAT’s Si photonic chips and the industrial automation company’s QFN packages. The textured film securely holds devices of different sizes on a single carrier, which eliminates the need for custom molded carriers. The texturized film carrier saves time and eliminates the costs associated with molding a custom carrier or purchasing individual carriers for each unique device size. About Gel-Pak Founded in 1980, Gel-Pak manufactures a line of proprietary gel and elastomer based device carriers and films that offer solutions for applications where damage during handling must be avoided. The company’s unique elastomer technology serves as the basis of its Gel-Box™, Gel-Tray®, Gel-Slide®, E-Film™ and patented Vacuum Release `(VR) products. These products effectively immobilize devices during shipping and in-process handling. For further information on Gel-Pak’s product line, please refer to the website at www.gelpak.com About Delphon Delphon is the materials incubator and advanced manufacturing center known for solving unique product development and manufacturing challenges. By combining unique materials and proprietary technologies in its state-of-the-art clean-room lab, Delphon partners with customers to move ideas quickly into novel products. Its well-known brands Gel-Pak, UltraTape and TouchMark are innovators of solutions for diverse markets including semiconductors, data storage, advanced medical devices, optical, photonics, aerospace, defense, automotive and telecom. For further information regarding Delphon’s capabilities, please refer to the website at www.delphon.com Download PDF File Gel-Pak's experienced technical support staff is available to answer your questions related to products or associated applications. Contact Us!